Joint industry standard requirements for electronic grade solder allls and fluxed and non-fluxed solid solders for electronic soldering applications
Bare board electrical test information in digital form
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0004865504 / 1999-04-01
Date of Publication:
March 15, 1992
Date of Creation:
1992
Title:
Bare board electrical test information in digital form : ANSI/IPC-D-356.
Description:
23 p.
Copyright Claimant:
IPC-Association Connecting Electronics Industry
Names:
IPC-Association Connecting Electronics Industry
Rework of electronic assemblies
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0004963145 / 1999-04-01
Date of Publication:
February 15, 1998
Date of Creation:
1998
Title:
Rework of electronic assemblies : IPC-7711.
Basis of Claim:
New Matter: additional text & editorial revision.
Imprint:
Northbrook, IL : IPC, c1998.
Description:
1 v.
Copyright Claimant:
IPC-Association Connecting Electronics Industry
Names:
IPC-Association Connecting Electronics Industry
Metal foil for printed wiring applications
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005148268 / 2000-07-28
Date of Publication:
May 31, 2000
Date of Creation:
2000
Title:
Metal foil for printed wiring applications : IPC-4562.
Basis of Claim:
New Matter: compilation and additions.
Description:
21 p.
Variant title:
Metal foil for printed wiring applications : IPC-4562.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries (30 documents)
example document: Optoelectronics assembly and packaging technology
example document: Optoelectronics assembly and packaging technology
|
Printed board dimensions and tolerances
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005200135 / 2000-07-28
Date of Publication:
July 17, 2000
Date of Creation:
2000
Title:
Printed board dimensions and tolerances : IPC-2615.
Basis of Claim:
New Matter: additions & compilation.
Copyright Note:
C.O. correspondence.
Description:
60 p.
Variant title:
Printed board dimensions and tolerances : IPC-2615.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Qualification and performance specification for flexible printed boards
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005200136 / 2000-07-28
Date of Publication:
May 11, 2000
Date of Creation:
2000
Title:
Qualification and performance specification for flexible printed boards : IPC-6013, amendment 1.
Basis of Claim:
New Matter: additions & compilation.
Previous Registration:
Prev. reg. 1999, TX 4-963-081.
Copyright Note:
C.O. correspondence.
Description:
13 p.
Variant title:
Qualification and performance specification for flexible printed boards : IPC-6013, amendment 1.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
IPC printed circuits expo
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005276083 / 2000-07-31
Date of Publication:
March 16, 2000
Date of Creation:
2000
Title:
IPC printed circuits expo.
Application Title:
Expo 2000: proceedings of the technical conference.
Description:
1 v.
Other Title:
IPC printed circuit expo, San Diego, 2000
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Notes:
Held in San Diego, Apr. 4-6, 2000.
Names:
IPC-Association Connecting Electronics Industries
Stencil design guidelines
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005276263 / 2000-07-31
Date of Publication:
June 2, 2000
Date of Creation:
2000
Title:
Stencil design guidelines : IPC-7525.
Description:
10 p.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
In-process DPMO and estimated yield for PWAs
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005575552 / 2002-07-18
Date of Publication:
March 13, 2002
Date of Creation:
2002
Title:
In-process DPMO and estimated yield for PWAs : IPC-9261.
Description:
10 p.
Variant title:
In-process DPMO and estimated yield for PWAs : IPC-9261.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Sectional requirements for supply chain communication of bill of materiall and product design configuration data
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005601928 / 2002-09-09
Date of Publication:
November 20, 2001
Date of Creation:
2001
Title:
Sectional requirements for supply chain communication of bill of materiall and product design configuration data : product data eXchange (PDX), IPC-2578.
Description:
1 v.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Joint industry standard requirements for electronic grade solder allls and fluxed and non-fluxed solid solders for electronic soldering applications
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005601929 / 2002-09-09
Date of Publication:
March 6, 2002
Date of Creation:
1996
Title:
Joint industry standard requirements for electronic grade solder allls and fluxed and non-fluxed solid solders for electronic soldering applications : IPC/EIA J-STD-006A.
Basis of Claim:
New Matter: additions & updating.
Description:
18 p.
Variant title:
Joint industry standard requirements for electronic grade solder allls and fluxed and non-fluxed solid solders for
Copyright Claimant:
IPC-Association Connecting Electronics Industries & Electronic Industries Alliance
Names:
IPC-Association Connecting Electronics Industries
Electronic Industries Alliance
Electronic Industries Alliance
|
Generic requirements for implementation of product manufacturing description data and transfer XML schema methodology
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005601930 / 2002-09-09
Date of Publication:
February 15, 2002
Date of Creation:
2002
Title:
Generic requirements for implementation of product manufacturing description data and transfer XML schema methodology : IPC-2511B.
Description:
174 p.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Microwave end product board inspection and trust
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005649518 / 2002-11-13
Date of Publication:
January 10, 2002
Date of Creation:
2002
Title:
Microwave end product board inspection and trust : IPC-6018A.
Basis of Claim:
New Matter: additions & updating.
Description:
27 p.
Variant title:
Microwave end product board inspection and trust : IPC-6018A.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Generic requirements for electronics manufacturiing shop-floor equipment communication messages (CAMX)
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913917 / 2002-09-09
Date of Publication:
November 20, 2001
Date of Creation:
2001
Title:
Generic requirements for electronics manufacturiing shop-floor equipment communication messages (CAMX) : IPC-2541.
Copyright Note:
C.O. correspondence.
Description:
167 p.
Variant title:
Generic requirements for electronics manufacturiing shop-floor equipment communication messages (CAMX) : IPC-2541.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Adhesive coated dielectric films for use as cover sheets for flexible printed circuitry and flexible adhesive bonding films
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913918 / 2002-08-16
Date of Publication:
June 27, 2002
Date of Creation:
2002
Title:
Adhesive coated dielectric films for use as cover sheets for flexible printed circuitry and flexible adhesive bonding films : IPC-4203.
Basis of Claim:
New Matter: additional text.
Copyright Note:
C.O. correspondence.
Description:
38 p.
Variant title:
Adhesive coated dielectric films for use as cover sheets for flexible printed circuitry and flexible adhesive
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Flexible base dielectrics for use in flexible printed circuitry
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913919 / 2002-08-16
Date of Publication:
June 27, 2002
Date of Creation:
2002
Title:
Flexible base dielectrics for use in flexible printed circuitry : IPC-4202.
Basis of Claim:
New Matter: additions & revisions.
Previous Registration:
Prev. reg. 1998, TX 4-743-453.
Copyright Note:
C.O. correspondence.
Description:
24 p.
Variant title:
Flexible base dielectrics for use in flexible printed circuitry : IPC-4202.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Flexible metal-clad dielectrics for use in fabrication of flexible printed circuitry
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913920 / 2002-08-16
Date of Publication:
June 27, 2002
Date of Creation:
2002
Title:
Flexible metal-clad dielectrics for use in fabrication of flexible printed circuitry : IPC-4204.
Basis of Claim:
New Matter: additional text.
Copyright Note:
C.O. correspondence.
Description:
49 p.
Variant title:
Flexible metal-clad dielectrics for use in fabrication of flexible printed circuitry : IPC-4204.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Guidelines and requirements for electrical testing of unpopulated printed boards
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913921 / 2002-08-16
Date of Publication:
February 8, 2001
Date of Creation:
2001
Title:
Guidelines and requirements for electrical testing of unpopulated printed boards : IPC-9252.
Basis of Claim:
New Matter: additional text.
Copyright Note:
C.O. correspondence.
Description:
1 v.
Variant title:
Guidelines and requirements for electrical testing of unpopulated printed boards : IPC-9252.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries (30 documents)
example document: Optoelectronics assembly and packaging technology
example document: Optoelectronics assembly and packaging technology
Specification for base materials for rigid and multilayer printed boards
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913922 / 2002-08-16
Date of Publication:
July 12, 2002
Date of Creation:
2002
Title:
Specification for base materials for rigid and multilayer printed boards : IPC-4101A with amendment 1.
Basis of Claim:
New Matter: additional text.
Previous Registration:
Prev. reg. 1999, TX 4-964-443.
Copyright Note:
C.O. correspondence.
Description:
1 v.
Variant title:
Specification for base materials for rigid and multilayer printed boards : IPC-4101A with amendment 1.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Performance test methods and qualification requirements for surface mount solder attachments
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913923 / 2002-08-16
Date of Publication:
June 21, 2002
Date of Creation:
2002
Title:
Performance test methods and qualification requirements for surface mount solder attachments : IPC-9701.
Copyright Note:
C.O. correspondence.
Description:
1 v.
Variant title:
Performance test methods and qualification requirements for surface mount solder attachments : IPC-9701.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Post solder semi-aqueous cleaning handbook
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913924 / 2002-08-16
Date of Publication:
June 2, 2011
Date of Creation:
2002
Title:
Post solder semi-aqueous cleaning handbook : IPC-SA-61A.
Basis of Claim:
New Matter: additional text.
Copyright Note:
C.O. correspondence.
Description:
28 p.
Variant title:
Post solder semi-aqueous cleaning handbook : IPC-SA-61A.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Performance standard for ball grid array balls
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913925 / 2002-08-16
Date of Publication:
June 2, 2011
Date of Creation:
2002
Title:
Performance standard for ball grid array balls : IPC/EIA J-STD-032.
Copyright Note:
C.O. correspondence.
Series:
Joint industry standard
Description:
10 p.
Variant title:
Performance standard for ball grid array balls : IPC/EIA J-STD-032.
Other Title:
Joint industry standard
Copyright Claimant:
IPC-Association Connecting Electronics Industries & EIA-Electronic Industries Alliance
Names:
IPC-Association Connecting Electronics Industries
EIA-Electronic Industries Alliance
EIA-Electronic Industries Alliance
Specification for finished fabric woven from "E" glass f0r printed boards
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913926 / 2002-08-16
Date of Publication:
July 12, 2002
Date of Creation:
2002
Title:
Specification for finished fabric woven from "E" glass f0r printed boards : IPC-4112.
Basis of Claim:
New Matter: additional text.
Previous Registration:
Prev. reg. 1998, TX 4-927-008.
Copyright Note:
C.O. correspondence.
Description:
1 v.
Variant title:
Specification for finished fabric woven from "E" glass f0r printed boards : IPC-4112.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Moisture/reflow sensitivity classification for nonmermetic solid state surface mount devices
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913927 / 2002-11-13
Date of Publication:
July 1, 2002
Date of Creation:
2002
Title:
Moisture/reflow sensitivity classification for nonmermetic solid state surface mount devices : IPC/JEDEC J-STD-020B.
Basis of Claim:
New Matter: additional text.
Copyright Note:
C.O. correspondence.
Series:
Joint industry standard
Description:
10 p.
Variant title:
Moisture/reflow sensitivity classification for nonmermetic solid state surface mount devices : IPC/JEDEC J-STD-020B.
Other Title:
Joint industry standard
Copyright Claimant:
IPC-Association Connecting Electronics Industries & Joint Electron Device Engineering Council
Names:
IPC-Association Connecting Electronics Industries
Joint Electron Device Engineering Council
Joint Electron Device Engineering Council
|
Printed board process capability, quality, and relative reliability (PCQR2) benchmark test standard and database
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913928 / 2002-11-13
Date of Publication:
June 1, 2002
Date of Creation:
2002
Title:
Printed board process capability, quality, and relative reliability (PCQR2) benchmark test standard and database : IPC-9151.
Copyright Note:
C.O. correspondence.
Description:
10 p.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries (30 documents)
example document: Optoelectronics assembly and packaging technology
example document: Optoelectronics assembly and packaging technology
Handling, packing, shipping and use of moisture/reflow sensitive surface mount devices
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913929 / 2002-09-09
Date of Publication:
August 9, 2002
Date of Creation:
2002
Title:
Handling, packing, shipping and use of moisture/reflow sensitive surface mount devices : IPC/JEDEC J-STD-033A.
Basis of Claim:
New Matter: additional text.
Copyright Note:
C.O. correspondence.
Series:
Joint industry standard
Description:
12 p.
Variant title:
Handling, packing, shipping and use of moisture/reflow sensitive surface mount devices : IPC/JEDEC J-STD-033A.
Other Title:
Joint industry standard
Copyright Claimant:
IPC-Association Connecting Electronics Industries & JEDEC-Joint Electron Device Engineering Council
Names:
IPC-Association Connecting Electronics Industries
JEDEC-Joint Electron Device Engineering Council
JEDEC-Joint Electron Device Engineering Council
Sectional requirements for shop-floor equipment communication messages (CAMX) for printed circuit board test, inspection and rework
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913930 / 2002-09-09
Date of Publication:
March 20, 2002
Date of Creation:
2002
Title:
Sectional requirements for shop-floor equipment communication messages (CAMX) for printed circuit board test, inspection and rework : IPC-2547.
Copyright Note:
C.O. correspondence.
Description:
50 p.
Variant title:
Sectional requirements for shop-floor equipment communication messages (CAMX) for printed circuit board test,
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Sectional requirements for shop-floor equipment communication messages (CAMX) for printed circuit board assembly
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913931 / 2002-09-09
Date of Publication:
November 20, 2001
Date of Creation:
2001
Title:
Sectional requirements for shop-floor equipment communication messages (CAMX) for printed circuit board assembly : IPC-2546.
Copyright Note:
C.O. correspondence.
Description:
67 p.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Mechanical outline standard for flip chip and chip size configurations
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0006122594 / 2004-06-24
Date of Publication:
February 15, 2003
Date of Creation:
2003
Title:
Mechanical outline standard for flip chip and chip size configurations : IPC J-STD-027.
Copyright Note:
C.O. correspondence.
Cataloged from appl. only.
Cataloged from appl. only.
Other Title:
IPC J-STD-027
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Requirements for soldering fluxes
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0006122595 / 2004-06-24
Date of Publication:
January 15, 2004
Date of Creation:
2004
Title:
Requirements for soldering fluxes : IPC J-STD-004A.
Basis of Claim:
New Matter: additions & revisions.
Previous Registration:
IPC J-STD-004.
Copyright Note:
C.O. correspondence.
Cataloged from appl. only.
Cataloged from appl. only.
Other Title:
IPC J-STD-004A
IPC J-STD-004
IPC J-STD-004
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
Terms and definitions for interconnecting and packaging electronic circuits
Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0006122596 / 2004-06-24
Date of Publication:
December 15, 2003
Date of Creation:
2003
Title:
Terms and definitions for interconnecting and packaging electronic circuits : IPC T-50G.
Basis of Claim:
New Matter: additions & revisions.
Previous Registration:
IPC T-50F.
Copyright Note:
C.O. correspondence.
Cataloged from appl. only.
Cataloged from appl. only.
Other Title:
IPC T-50G
IPC T-50F
IPC T-50F
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries
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