Joint industry standard requirements for electronic grade solder allls and fluxed and non-fluxed solid solders for electronic soldering applications





Bare board electrical test information in digital form

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0004865504 / 1999-04-01
Date of Publication:
March 15, 1992
Date of Creation:
1992
Title:
Bare board electrical test information in digital form : ANSI/IPC-D-356.
Description:
23 p.
Copyright Claimant:
IPC-Association Connecting Electronics Industry
Names:
IPC-Association Connecting Electronics Industry

Rework of electronic assemblies

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0004963145 / 1999-04-01
Date of Publication:
February 15, 1998
Date of Creation:
1998
Title:
Rework of electronic assemblies : IPC-7711.
Basis of Claim:
New Matter: additional text & editorial revision.
Imprint:
Northbrook, IL : IPC, c1998.
Description:
1 v.
Copyright Claimant:
IPC-Association Connecting Electronics Industry
Names:
IPC-Association Connecting Electronics Industry

Metal foil for printed wiring applications

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005148268 / 2000-07-28
Date of Publication:
May 31, 2000
Date of Creation:
2000
Title:
Metal foil for printed wiring applications : IPC-4562.
Basis of Claim:
New Matter: compilation and additions.
Description:
21 p.
Variant title:
Metal foil for printed wiring applications : IPC-4562.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries (30 documents)
example document: Optoelectronics assembly and packaging technology

Copyrights records by IPC-Association Connecting Electronics Industries



Printed board dimensions and tolerances

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005200135 / 2000-07-28
Date of Publication:
July 17, 2000
Date of Creation:
2000
Title:
Printed board dimensions and tolerances : IPC-2615.
Basis of Claim:
New Matter: additions & compilation.
Copyright Note:
C.O. correspondence.
Description:
60 p.
Variant title:
Printed board dimensions and tolerances : IPC-2615.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Qualification and performance specification for flexible printed boards

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005200136 / 2000-07-28
Date of Publication:
May 11, 2000
Date of Creation:
2000
Title:
Qualification and performance specification for flexible printed boards : IPC-6013, amendment 1.
Basis of Claim:
New Matter: additions & compilation.
Previous Registration:
Prev. reg. 1999, TX 4-963-081.
Copyright Note:
C.O. correspondence.
Description:
13 p.
Variant title:
Qualification and performance specification for flexible printed boards : IPC-6013, amendment 1.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

IPC printed circuits expo

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005276083 / 2000-07-31
Date of Publication:
March 16, 2000
Date of Creation:
2000
Title:
IPC printed circuits expo.
Application Title:
Expo 2000: proceedings of the technical conference.
Description:
1 v.
Other Title:
IPC printed circuit expo, San Diego, 2000
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Notes:
Held in San Diego, Apr. 4-6, 2000.
Names:
IPC-Association Connecting Electronics Industries

Stencil design guidelines

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005276263 / 2000-07-31
Date of Publication:
June 2, 2000
Date of Creation:
2000
Title:
Stencil design guidelines : IPC-7525.
Description:
10 p.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

In-process DPMO and estimated yield for PWAs

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005575552 / 2002-07-18
Date of Publication:
March 13, 2002
Date of Creation:
2002
Title:
In-process DPMO and estimated yield for PWAs : IPC-9261.
Description:
10 p.
Variant title:
In-process DPMO and estimated yield for PWAs : IPC-9261.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Sectional requirements for supply chain communication of bill of materiall and product design configuration data

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005601928 / 2002-09-09
Date of Publication:
November 20, 2001
Date of Creation:
2001
Title:
Sectional requirements for supply chain communication of bill of materiall and product design configuration data : product data eXchange (PDX), IPC-2578.
Description:
1 v.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Joint industry standard requirements for electronic grade solder allls and fluxed and non-fluxed solid solders for electronic soldering applications

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005601929 / 2002-09-09
Date of Publication:
March 6, 2002
Date of Creation:
1996
Title:
Joint industry standard requirements for electronic grade solder allls and fluxed and non-fluxed solid solders for electronic soldering applications : IPC/EIA J-STD-006A.
Basis of Claim:
New Matter: additions & updating.
Description:
18 p.
Variant title:
Joint industry standard requirements for electronic grade solder allls and fluxed and non-fluxed solid solders for
Copyright Claimant:
IPC-Association Connecting Electronics Industries & Electronic Industries Alliance
Names:
IPC-Association Connecting Electronics Industries
Electronic Industries Alliance

Copyrights records by Electronic Industries Alliance



Generic requirements for implementation of product manufacturing description data and transfer XML schema methodology

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005601930 / 2002-09-09
Date of Publication:
February 15, 2002
Date of Creation:
2002
Title:
Generic requirements for implementation of product manufacturing description data and transfer XML schema methodology : IPC-2511B.
Description:
174 p.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Microwave end product board inspection and trust

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005649518 / 2002-11-13
Date of Publication:
January 10, 2002
Date of Creation:
2002
Title:
Microwave end product board inspection and trust : IPC-6018A.
Basis of Claim:
New Matter: additions & updating.
Description:
27 p.
Variant title:
Microwave end product board inspection and trust : IPC-6018A.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Generic requirements for electronics manufacturiing shop-floor equipment communication messages (CAMX)

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913917 / 2002-09-09
Date of Publication:
November 20, 2001
Date of Creation:
2001
Title:
Generic requirements for electronics manufacturiing shop-floor equipment communication messages (CAMX) : IPC-2541.
Copyright Note:
C.O. correspondence.
Description:
167 p.
Variant title:
Generic requirements for electronics manufacturiing shop-floor equipment communication messages (CAMX) : IPC-2541.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Adhesive coated dielectric films for use as cover sheets for flexible printed circuitry and flexible adhesive bonding films

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913918 / 2002-08-16
Date of Publication:
June 27, 2002
Date of Creation:
2002
Title:
Adhesive coated dielectric films for use as cover sheets for flexible printed circuitry and flexible adhesive bonding films : IPC-4203.
Basis of Claim:
New Matter: additional text.
Copyright Note:
C.O. correspondence.
Description:
38 p.
Variant title:
Adhesive coated dielectric films for use as cover sheets for flexible printed circuitry and flexible adhesive
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Flexible base dielectrics for use in flexible printed circuitry

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913919 / 2002-08-16
Date of Publication:
June 27, 2002
Date of Creation:
2002
Title:
Flexible base dielectrics for use in flexible printed circuitry : IPC-4202.
Basis of Claim:
New Matter: additions & revisions.
Previous Registration:
Prev. reg. 1998, TX 4-743-453.
Copyright Note:
C.O. correspondence.
Description:
24 p.
Variant title:
Flexible base dielectrics for use in flexible printed circuitry : IPC-4202.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Flexible metal-clad dielectrics for use in fabrication of flexible printed circuitry

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913920 / 2002-08-16
Date of Publication:
June 27, 2002
Date of Creation:
2002
Title:
Flexible metal-clad dielectrics for use in fabrication of flexible printed circuitry : IPC-4204.
Basis of Claim:
New Matter: additional text.
Copyright Note:
C.O. correspondence.
Description:
49 p.
Variant title:
Flexible metal-clad dielectrics for use in fabrication of flexible printed circuitry : IPC-4204.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Guidelines and requirements for electrical testing of unpopulated printed boards

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913921 / 2002-08-16
Date of Publication:
February 8, 2001
Date of Creation:
2001
Title:
Guidelines and requirements for electrical testing of unpopulated printed boards : IPC-9252.
Basis of Claim:
New Matter: additional text.
Copyright Note:
C.O. correspondence.
Description:
1 v.
Variant title:
Guidelines and requirements for electrical testing of unpopulated printed boards : IPC-9252.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries (30 documents)
example document: Optoelectronics assembly and packaging technology

Specification for base materials for rigid and multilayer printed boards

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913922 / 2002-08-16
Date of Publication:
July 12, 2002
Date of Creation:
2002
Title:
Specification for base materials for rigid and multilayer printed boards : IPC-4101A with amendment 1.
Basis of Claim:
New Matter: additional text.
Previous Registration:
Prev. reg. 1999, TX 4-964-443.
Copyright Note:
C.O. correspondence.
Description:
1 v.
Variant title:
Specification for base materials for rigid and multilayer printed boards : IPC-4101A with amendment 1.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Performance test methods and qualification requirements for surface mount solder attachments

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913923 / 2002-08-16
Date of Publication:
June 21, 2002
Date of Creation:
2002
Title:
Performance test methods and qualification requirements for surface mount solder attachments : IPC-9701.
Copyright Note:
C.O. correspondence.
Description:
1 v.
Variant title:
Performance test methods and qualification requirements for surface mount solder attachments : IPC-9701.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Post solder semi-aqueous cleaning handbook

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913924 / 2002-08-16
Date of Publication:
June 2, 2011
Date of Creation:
2002
Title:
Post solder semi-aqueous cleaning handbook : IPC-SA-61A.
Basis of Claim:
New Matter: additional text.
Copyright Note:
C.O. correspondence.
Description:
28 p.
Variant title:
Post solder semi-aqueous cleaning handbook : IPC-SA-61A.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Performance standard for ball grid array balls

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913925 / 2002-08-16
Date of Publication:
June 2, 2011
Date of Creation:
2002
Title:
Performance standard for ball grid array balls : IPC/EIA J-STD-032.
Copyright Note:
C.O. correspondence.
Series:
Joint industry standard
Description:
10 p.
Variant title:
Performance standard for ball grid array balls : IPC/EIA J-STD-032.
Other Title:
Joint industry standard
Copyright Claimant:
IPC-Association Connecting Electronics Industries & EIA-Electronic Industries Alliance
Names:
IPC-Association Connecting Electronics Industries
EIA-Electronic Industries Alliance

Specification for finished fabric woven from "E" glass f0r printed boards

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913926 / 2002-08-16
Date of Publication:
July 12, 2002
Date of Creation:
2002
Title:
Specification for finished fabric woven from "E" glass f0r printed boards : IPC-4112.
Basis of Claim:
New Matter: additional text.
Previous Registration:
Prev. reg. 1998, TX 4-927-008.
Copyright Note:
C.O. correspondence.
Description:
1 v.
Variant title:
Specification for finished fabric woven from "E" glass f0r printed boards : IPC-4112.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Moisture/reflow sensitivity classification for nonmermetic solid state surface mount devices

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913927 / 2002-11-13
Date of Publication:
July 1, 2002
Date of Creation:
2002
Title:
Moisture/reflow sensitivity classification for nonmermetic solid state surface mount devices : IPC/JEDEC J-STD-020B.
Basis of Claim:
New Matter: additional text.
Copyright Note:
C.O. correspondence.
Series:
Joint industry standard
Description:
10 p.
Variant title:
Moisture/reflow sensitivity classification for nonmermetic solid state surface mount devices : IPC/JEDEC J-STD-020B.
Other Title:
Joint industry standard
Copyright Claimant:
IPC-Association Connecting Electronics Industries & Joint Electron Device Engineering Council
Names:
IPC-Association Connecting Electronics Industries
Joint Electron Device Engineering Council

Copyrights records by Joint Electron Device Engineering Council



Printed board process capability, quality, and relative reliability (PCQR2) benchmark test standard and database

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913928 / 2002-11-13
Date of Publication:
June 1, 2002
Date of Creation:
2002
Title:
Printed board process capability, quality, and relative reliability (PCQR2) benchmark test standard and database : IPC-9151.
Copyright Note:
C.O. correspondence.
Description:
10 p.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries (30 documents)
example document: Optoelectronics assembly and packaging technology

Handling, packing, shipping and use of moisture/reflow sensitive surface mount devices

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913929 / 2002-09-09
Date of Publication:
August 9, 2002
Date of Creation:
2002
Title:
Handling, packing, shipping and use of moisture/reflow sensitive surface mount devices : IPC/JEDEC J-STD-033A.
Basis of Claim:
New Matter: additional text.
Copyright Note:
C.O. correspondence.
Series:
Joint industry standard
Description:
12 p.
Variant title:
Handling, packing, shipping and use of moisture/reflow sensitive surface mount devices : IPC/JEDEC J-STD-033A.
Other Title:
Joint industry standard
Copyright Claimant:
IPC-Association Connecting Electronics Industries & JEDEC-Joint Electron Device Engineering Council
Names:
IPC-Association Connecting Electronics Industries
JEDEC-Joint Electron Device Engineering Council

Sectional requirements for shop-floor equipment communication messages (CAMX) for printed circuit board test, inspection and rework

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913930 / 2002-09-09
Date of Publication:
March 20, 2002
Date of Creation:
2002
Title:
Sectional requirements for shop-floor equipment communication messages (CAMX) for printed circuit board test, inspection and rework : IPC-2547.
Copyright Note:
C.O. correspondence.
Description:
50 p.
Variant title:
Sectional requirements for shop-floor equipment communication messages (CAMX) for printed circuit board test,
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Sectional requirements for shop-floor equipment communication messages (CAMX) for printed circuit board assembly

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0005913931 / 2002-09-09
Date of Publication:
November 20, 2001
Date of Creation:
2001
Title:
Sectional requirements for shop-floor equipment communication messages (CAMX) for printed circuit board assembly : IPC-2546.
Copyright Note:
C.O. correspondence.
Description:
67 p.
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Mechanical outline standard for flip chip and chip size configurations

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0006122594 / 2004-06-24
Date of Publication:
February 15, 2003
Date of Creation:
2003
Title:
Mechanical outline standard for flip chip and chip size configurations : IPC J-STD-027.
Copyright Note:
C.O. correspondence.
Cataloged from appl. only.
Other Title:
IPC J-STD-027
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Requirements for soldering fluxes

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0006122595 / 2004-06-24
Date of Publication:
January 15, 2004
Date of Creation:
2004
Title:
Requirements for soldering fluxes : IPC J-STD-004A.
Basis of Claim:
New Matter: additions & revisions.
Previous Registration:
IPC J-STD-004.
Copyright Note:
C.O. correspondence.
Cataloged from appl. only.
Other Title:
IPC J-STD-004A
IPC J-STD-004
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

Terms and definitions for interconnecting and packaging electronic circuits

Type of Work:
Non-dramatic literary work
Registration Number / Date:
TX0006122596 / 2004-06-24
Date of Publication:
December 15, 2003
Date of Creation:
2003
Title:
Terms and definitions for interconnecting and packaging electronic circuits : IPC T-50G.
Basis of Claim:
New Matter: additions & revisions.
Previous Registration:
IPC T-50F.
Copyright Note:
C.O. correspondence.
Cataloged from appl. only.
Other Title:
IPC T-50G
IPC T-50F
Copyright Claimant:
IPC-Association Connecting Electronics Industries
Names:
IPC-Association Connecting Electronics Industries

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